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Academic Journal

What is the role of small bowel capsule endoscopy in established coeliac disease?

  • Source: In Clinics and Research in Hepatology and Gastroenterology October 2020 44(5):753-761

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Conference

High throughput, tree automata based XML processing using FPGAs

Subjects: Components, Circuits, Devices and Systems; Computing and Processing; General Topics for Engineers

  • Source: 2013 International Conference on Field-Programmable Technology (FPT) Field-Programmable Technology (FPT), 2013 International Conference on. :74-81 Dec, 2013

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Academic Journal

High-Efficiency Full Back Contacted Cells Using Industrial Processes

Subjects: Photonics and Electrooptics; Doping; Surface treatment

  • Source: IEEE Journal of Photovoltaics IEEE J. Photovoltaics Photovoltaics, IEEE Journal of. 4(1):130-133 Jan, 2014

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Academic Journal

Mapping the landscape of cataract surgery teaching assessment in Canadian residency programs

  • Source: In Canadian Journal of Ophthalmology/Journal canadien d'ophtalmologie April 2019 54(2):155-158

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Conference

Boron diffused emitter etch back and passivation

Subjects: Photonics and Electrooptics; Power, Energy and Industry Applications; Components, Circuits, Devices and Systems

  • Source: 2012 38th IEEE Photovoltaic Specialists Conference Photovoltaic Specialists Conference (PVSC), 2012 38th IEEE. :001073-001076 Jun, 2012

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Conference

Rear side dielectrics choices in PERC solar cells

Subjects: Components, Circuits, Devices and Systems; Aluminum oxide; Films

  • Source: 2013 IEEE 39th Photovoltaic Specialists Conference (PVSC) Photovoltaic Specialists Conference (PVSC), 2013 IEEE 39th. :1781-1783 Jun, 2013

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Conference

Interdigitated back contact silicon solar cells with laser fired contacts

Subjects: Components, Circuits, Devices and Systems; Surface emitting lasers; Silicon

  • Source: 2013 IEEE 39th Photovoltaic Specialists Conference (PVSC) Photovoltaic Specialists Conference (PVSC), 2013 IEEE 39th. :1298-1300 Jun, 2013

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Conference

Fracture mechanism map for the fracture of microelectronic Pb-free solder joints under dynamic loading conditions

Subjects: Soldering; Strain; Aging

  • Source: 2010 12th Electronics Packaging Technology Conference Electronics Packaging Technology Conference (EPTC), 2010 12th. :298-303 Dec, 2010

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  • 1-10 of  711 results for ""Sidhu, R.""