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Fabrication of lightweight CMF/RGO/Ag nanocomposite foam via a simple pyrolysis method for highly effective electromagnetic interference (EMI) shielding

Subjects: Components, Circuits, Devices and Systems; Fields, Waves and Electromagnetics; Photonics and Electrooptics

  • Source: 2020 21st International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2020 21st International Conference on. :1-4 Aug, 2020

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Research on Pad Size Design of 1210/0805 Surface Mounting Capacitor and Shear Strength Comparison

Subjects: Components, Circuits, Devices and Systems; Fields, Waves and Electromagnetics; Photonics and Electrooptics

  • Source: 2020 21st International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2020 21st International Conference on. :1-6 Aug, 2020

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Lightweight and Flexible Fe3O4/MXene/Cellulose Nanofiber Film with Gradient and Sandwich Structure for Superior EMI Shielding Properties

Subjects: Components, Circuits, Devices and Systems; Fields, Waves and Electromagnetics; Photonics and Electrooptics

  • Source: 2020 21st International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2020 21st International Conference on. :1-4 Aug, 2020

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Fabrication of fine patterned structure for high-density Fan-Out Wafer Level Package using dry etching technology

Subjects: Components, Circuits, Devices and Systems; Fields, Waves and Electromagnetics; Photonics and Electrooptics

  • Source: 2020 21st International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2020 21st International Conference on. :1-5 Aug, 2020

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Conference

Low Temperature Fine Pitch Au-In Solid Liquid Inter Diffusion Bonding for Wafer Level Packaging

Subjects: Components, Circuits, Devices and Systems; Fields, Waves and Electromagnetics; Photonics and Electrooptics

  • Source: 2020 21st International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2020 21st International Conference on. :1-4 Aug, 2020

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Conference

Welding reactions of lead free solder alloy for aluminum packaging electronic devices

Subjects: Components, Circuits, Devices and Systems; Fields, Waves and Electromagnetics; Photonics and Electrooptics

  • Source: 2020 21st International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2020 21st International Conference on. :1-4 Aug, 2020

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Conference

Effect of Dry Degumming and Wet Etching Process on Uniformity of Solder Bumps Height and Size

Subjects: Components, Circuits, Devices and Systems; Fields, Waves and Electromagnetics; Photonics and Electrooptics

  • Source: 2020 21st International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2020 21st International Conference on. :1-5 Aug, 2020

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Research on Electrical Characteristics of Multi-chip Itegration for the Fifth-Generation Communication

Subjects: Components, Circuits, Devices and Systems; Fields, Waves and Electromagnetics; Photonics and Electrooptics

  • Source: 2020 21st International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2020 21st International Conference on. :1-5 Aug, 2020

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Conference

Wire Bonding and Soldering Study of Thin Ni-P ENEPIG Surface Finish

Subjects: Components, Circuits, Devices and Systems; Fields, Waves and Electromagnetics; Photonics and Electrooptics

  • Source: 2020 21st International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2020 21st International Conference on. :1-4 Aug, 2020

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Research on Forming Mechanism and Optimization Scheme of Acid-Etched Pinhole on High-Density Packaging Substrate

Subjects: Components, Circuits, Devices and Systems; Fields, Waves and Electromagnetics; Photonics and Electrooptics

  • Source: 2020 21st International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2020 21st International Conference on. :1-6 Aug, 2020

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  • 1-10 of  414,014 results for ""Photonics and Electrooptics""