AC coupled backplane communication using embedded capacitor

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  • Additional Information
    • Publication Information:
      IEEE
    • Publication Date:
      2008
    • Abstract:
      Surface mount capacitors can be replaced with a buried capacitor in backplane interconnect applications requiring blocking capacitance, such as FiberChannel. This replacement improves cost, reliability and parasitic inductance. The smaller nominal capacitance value can be compensated for by using an equalizing receiver filter. Tradeoffs in capacitance choice are explained in detail. A nominal capacitance of around 1 pF provides a good choice for the analyzed scenarios.
    • Contents Note:
      Conference Acronym: EPEP
    • Accession Number:
      LCCN: 2008907698
    • Author Affiliations:
      Dept. of ECE, North Carolina State Univ., Raleigh, NC
      Syst. & Technol. Group, IBM Corp., Austin, TX
      Syst. & Technol. Group, IBM Corp., Research Triangle Park, NC
    • ISBN:
      978-1-4244-2873-1
    • Relation:
      2008 IEEE 17th Conference on Electrical Performance of Electronic Packaging (EPEP)
    • Accession Number:
      10.1109/EPEP.2008.4675938
    • Rights:
      Copyright 2008, IEEE
    • AMSID:
      4675938
    • Conference Acronym:
      EPEP
    • Date of Current Version:
      2008
    • Document Subtype:
      IEEE Conference
    • Notes:
      Conference Location: San Jose, CA, USA

      Conference Start Date: 27 Oct. 2008

      Conference End Date: 29 Oct. 2008
    • Accession Number:
      edseee.4675938
  • Citations
    • ABNT:
      SU, B. et al. AC coupled backplane communication using embedded capacitor. 2008 IEEE-EPEP Electrical Performance of Electronic Packaging, Electrical Performance of Electronic Packaging, 2008 IEEE-EPEP, [s. l.], p. 295–298, 2008. DOI 10.1109/EPEP.2008.4675938. Disponível em: http://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=edseee&AN=edseee.4675938. Acesso em: 29 out. 2020.
    • AMA:
      Su B, Patel P, Hunter SW, Cases M, Franzon PD. AC coupled backplane communication using embedded capacitor. 2008 IEEE-EPEP Electrical Performance of Electronic Packaging, Electrical Performance of Electronic Packaging, 2008 IEEE-EPEP. October 2008:295-298. doi:10.1109/EPEP.2008.4675938
    • APA:
      Su, B., Patel, P., Hunter, S. W., Cases, M., & Franzon, P. D. (2008). AC coupled backplane communication using embedded capacitor. 2008 IEEE-EPEP Electrical Performance of Electronic Packaging, Electrical Performance of Electronic Packaging, 2008 IEEE-EPEP, 295–298. https://doi.org/10.1109/EPEP.2008.4675938
    • Chicago/Turabian: Author-Date:
      Su, B., P. Patel, S.W. Hunter, M. Cases, and P.D. Franzon. 2008. “AC Coupled Backplane Communication Using Embedded Capacitor.” 2008 IEEE-EPEP Electrical Performance of Electronic Packaging, Electrical Performance of Electronic Packaging, 2008 IEEE-EPEP, October, 295–98. doi:10.1109/EPEP.2008.4675938.
    • Harvard:
      Su, B. et al. (2008) ‘AC coupled backplane communication using embedded capacitor’, 2008 IEEE-EPEP Electrical Performance of Electronic Packaging, Electrical Performance of Electronic Packaging, 2008 IEEE-EPEP, pp. 295–298. doi: 10.1109/EPEP.2008.4675938.
    • Harvard: Australian:
      Su, B, Patel, P, Hunter, SW, Cases, M & Franzon, PD 2008, ‘AC coupled backplane communication using embedded capacitor’, 2008 IEEE-EPEP Electrical Performance of Electronic Packaging, Electrical Performance of Electronic Packaging, 2008 IEEE-EPEP, pp. 295–298, viewed 29 October 2020, .
    • MLA:
      Su, B., et al. “AC Coupled Backplane Communication Using Embedded Capacitor.” 2008 IEEE-EPEP Electrical Performance of Electronic Packaging, Electrical Performance of Electronic Packaging, 2008 IEEE-EPEP, Oct. 2008, pp. 295–298. EBSCOhost, doi:10.1109/EPEP.2008.4675938.
    • Chicago/Turabian: Humanities:
      Su, B., P. Patel, S.W. Hunter, M. Cases, and P.D. Franzon. “AC Coupled Backplane Communication Using Embedded Capacitor.” 2008 IEEE-EPEP Electrical Performance of Electronic Packaging, Electrical Performance of Electronic Packaging, 2008 IEEE-EPEP, October 1, 2008, 295–98. doi:10.1109/EPEP.2008.4675938.
    • Vancouver/ICMJE:
      Su B, Patel P, Hunter SW, Cases M, Franzon PD. AC coupled backplane communication using embedded capacitor. 2008 IEEE-EPEP Electrical Performance of Electronic Packaging, Electrical Performance of Electronic Packaging, 2008 IEEE-EPEP [Internet]. 2008 Oct 1 [cited 2020 Oct 29];295–8. Available from: http://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=edseee&AN=edseee.4675938